Circular 32/2025/TT-BKHCN on the List of semiconductor raw materials, equipment, machinery, and tools for the semiconductor industry that are encouraged for investment and development.

MINISTRY OF SCIENCE AND TECHNOLOGY
TECHNOLOGY
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SOCIAL REPUBLIC OF VIETNAM
Independence - Freedom - Happiness
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Number: 32/2025/TT-BKHCN

Hanoi, date 15 month 11 year 2025

Recipients:
– The Prime Minister and Deputy Prime Ministers (for information/reporting);
- Central Office and Party Committees;
- Office of the General Secretary;
- Congress office;
- Office of the President;
- Ministries, Ministerial-level agencies, Government-attached agencies;
- Supreme People's Court;
- People's Procuratorate of the Supreme;
- State Audit;
– Central agencies of mass organizations;
– People's Committees of provinces and centrally-administered cities;
– Department of Document Review and Management of Administrative Violations (Ministry of Justice);
– Departments of Science and Technology of provinces and centrally-administered cities;
– Official Gazette, Government Electronic Information Portal;
– Ministry of Science and Technology: Minister and Deputy Ministers; agencies and units under the Ministry; Electronic Information Portal;
– Save: VT, CNCNTT (20b).

MINISTER

Nguyen Manh Hung

STT

Raw materials group

Description

1

High-purity silicon (Polysilicon)

Polycrystalline silicon of very high purity is used to manufacture single-crystal ingots for cutting into wafers.

2

Next-generation semiconductor compounds

Compounds such as SiC, GaAs, GaN, InP, etc., are used to manufacture semiconductor chips that can withstand high voltage, high temperature, high frequency, and so on.

3

Wafer

Semiconductor materials are melted to form single crystal ingots, which are then sliced, cleaned, polished, and oxidized to form wafers before circuit etching. Materials used to produce wafers include silicon (Si), silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), or indium phosphide (InP), etc.

4

Optical masks and materials used to create optical masks.

The substrate has the semiconductor chip design etched onto it for use in the photolithography process; the material used to create the photolithography mask.

5

Optoxide

Photosensitive material, coated/deposited onto the wafer surface during the photolithography process.

6

Chemicals used in semiconductor chip manufacturing.

Chemicals used directly in semiconductor chip production are employed in steps such as oxidation, photolithography, etching, deposition, ion implantation, cleaning, and packaging.

7

Specialized gases used in semiconductor chip manufacturing.

Specialized gases used in semiconductor chip manufacturing are employed in steps such as oxidation, photolithography, etching, deposition, ion implantation, cleaning, and packaging.

8

Sputtering targets

A block of metal material made of aluminum, titanium, copper, or alloy is used as a "target" in a PVD (Physical Vapor Deposition) system via sputtering. When bombarded by an ion beam/radiation, material from the target is ejected and adheres to the wafer or substrate surface, forming a thin metal/alloy film that facilitates connection and electrical conductivity.

9

Leadframes

Used to support and secure semiconductor chips; create electrical connections between the chip and the circuit board; help dissipate heat and provide mechanical protection for semiconductor chips.

10

Substrates

Insulating substrates (usually made from polymer or composite materials) are used to securely mount semiconductor chips, creating electrical connections between the chip and the printed circuit board (PCB), while also supporting heat dissipation and providing mechanical protection for the chip during packaging and operation.

11

Semiconductor chip packaging materials

Materials with good electrical and thermal insulation properties (ceramics, polymers, etc.) are used as casings for semiconductor chips, helping to protect them, ensure stable electrical connections, and dissipate heat effectively.

12

Bonding wires

Ultra-thin metal wires are used to provide electrical connections between semiconductor chips and output pins.

13

Materials for mounting wafers, dies, and semiconductor chips.

Specialized adhesives (glue, cutting tape, thin adhesive film, etc.) are used to attach wafers, dies (single semiconductor chips that are not yet packaged, cut from the wafer, and contain a complete integrated circuit), and semiconductor chips to the substrate/frame.

14

Technical ceramics

Specialized ceramics, possessing high hardness, good electrical insulation, and wear resistance, are used to manufacture components such as robot grippers, insulating parts, and components requiring high mechanical strength in semiconductor devices.

STT

Equipment, machinery, and tools

Description

I

Design

1

Semiconductor chip design/functional block (IP Cores)

These are pre-developed, reusable, modular design/functional blocks that allow other organizations to use them to design semiconductor chips.

2

Electronic Design Automation (EDA) tools

Specialized software tools are used to design, simulate, test, and optimize semiconductor chip designs.

3

The design rules for semiconductor chip manufacturing technology (PDKs) are a set of design guidelines for semiconductor chip manufacturing plants.

It is a set of rules, data, and models provided by semiconductor chip manufacturers to chip design companies to ensure the compatibility and manufacturability of the design with the manufacturer's technology.

4

Devices and systems used to evaluate semiconductor chip designs and IP Cores.

These are devices and systems used to simulate, test, and evaluate semiconductor chip designs and IP cores.

II

Semiconductor chip manufacturing, packaging, and testing.

5

Crystal growing furnaces

The device is used to create single-crystal ingots from silicon, silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), or indium phosphide (InP), ...

6

Crystal machining equipment

Equipment for slicing, grinding, leveling, polishing… single-crystal blanks to create wafers that meet standards for thickness, flatness, and surface smoothness.

7

Ion implant devices

The device is used to infuse "dopsants" into the silicon wafer to control the electrical properties (ionization) in different regions, thereby creating semiconductor chip components.

8

Photolithography equipment

Specialized equipment in semiconductor chip manufacturing works by shining light (UV/DUV/EUV/…) through a system of high-precision lenses to create details on the surface of silicon wafers that match the design in size and shape.

9

Thin film deposition equipment

The equipment is used to apply a thin layer of material (using technologies such as MBE (Molecular Beam Epitaxy), ALD (Atomic Layer Deposition), CVD (Chemical Vapor Deposition), PVD (Physical Vapor Deposition), etc.) with high precision onto the surface of a wafer to create insulating or conductive layers for building structures in semiconductor chips.

10

Etching equipment

The device performs the process of removing the photoresist layer to reveal the designed structure. The etching process is performed using gas/plasma (dry etching) or liquid chemicals (wet etching).

11

Wafer cleaning equipment

The device is designed to remove dust, impurities, and excess film (photoresist, polymer, unwanted oxide, etc.) from the wafer surface after processing steps.

12

Resist processing equipment

The equipment is used to coat, develop, and cure/cur the photoresist layer on the wafer surface before and after the photolithography step, ensuring the photoresist layer has the correct thickness, uniformity, and chemical properties, allowing the image projected through the optical mask to be accurately transmitted to the wafer.

13

Wafer bonding and alignment devices (Wafer bonders and aligners)

The device is used to bond two or more wafers together to create stacked structures – permanently attached; or to support processes such as thinning, processing, alignment, etc. – temporarily attached to a support wafer.

14

Automated material handling systems

The system includes devices for automatically transporting wafers, photomasks, and cassettes/FOUPs between steps/processes, aiming to reduce dust and increase productivity.

15

Process monitoring equipment

The device is used to measure, monitor, and control electrical and physical parameters throughout the semiconductor chip manufacturing process.

16

Dicing equipment

The device uses diamond saw blades or lasers to cut finished wafers into individual dies with high precision.

17

Integrated assembly equipment

The packaging system integrates multiple processes into a single, seamless line, for example: die attaching, wire bonding, molding, cutting, preliminary inspection, etc.

18

Testing equipment

The system includes equipment for wafer sorting, final testing, and loaders/trays/probes, used to measure the functionality, performance, reliability, and error screening of chips before shipment.